Article comprising a mechanically compliant bump
AssigneeAralight, Inc.
InventorsKeith W. Goossen, William Y. Jan
Life of this patent
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Abstract
Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles the upper surface of the mechanically compliant bump. The wall, which is capable of flexing or deforming under pressure provides mechanical compliance. The wall is able to flex or deform under pressure even if the bump is formed from high-temperature metal. These mechanically compliant bumps facilitate sound electrical connections even when an electronics device is brought into contact for bonding out of parallel.
Claims18
An article comprising a mechanically compliant bump, said mechanically compliant bump having:
- a base comprising a first metal, wherein a lower surface of said base is deposited on a contact pad;
- and
- a wall depending from a periphery of an upper surface of said base, said wall comprising said first metal, wherein:
- a width of said mechanically compliant bump increases with increasing distance from said lower surface of said base toward an upper surface of said wall.
An article comprising a mechanically compliant bump, said mechanically compliant bump comprising:
- a base electrically connected to an electronics device;
- and
- a wall depending from a periphery of an upper surface of said base, said wall encircling said upper surface of said base;
- wherein a width of said mechanically compliant bump increases with increasing distance from a lower surface of said base toward an upper surface of said wall, said increase in width defining a taper, said taper characterized by a taper angle that is at least about 5 degrees and not more than about thirty degrees.
Dependencies are inferred from the claim text.