US 6,388,321 B1 · Anisotropic conductive film and resin filling gap between a flip-chip and circuit board

Abstract

In order to obtain a semiconductor device of which bonding reliability between a semiconductor element 7 and a printed wiring board 1 is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element 7 on a printed wiring board 1, while a circumference of a metal bump 3 formed on a conductor pad electrode disposed on the printed wiring board in wiring pattern and an electrode 6 disposed along an external periphery of a semiconductor element 7 facing the metal bump 3 is provided with, along a placement position of the metal bump 3 or the electrode 6, frame- or wall-shaped anisotropic conductive film 4, a gap between the semiconductor element 7 and the printed wiring board 1, the insides of the anisotropic conductive film 4 formed in frame or wall shape, is filled by sealing material such as epoxy resin or the like.

Claims16

Dependent claims

A semiconductor device, comprising:

a printed wiring board having a wiring pattern;
a semiconductor element disposed on the printed wiring board;
a filling layer intervened between the printed wiring board and the semiconductor element and comprising a resin layer and an anisotropic conductive member including conductive particles;
and
a protrusion of a shape having a trapezoidal vertical section in which a ratio of an upper side and a lower side of the trapezoid is in a range of 1:1 to 1:1.5, formed on the wiring pattern and, together with the anisotropic conductive member, electrically bonding the wiring pattern and an electrode of the semiconductor element.

2 more elements

Dependencies are inferred from the claim text.

Anisotropic conductive film and resin filling gap between a flip-chip and circuit board

Life of this patent

Anisotropic conductive film and resin filling gap between a flip-chip and circuit board

Life of this patent

Abstract

Claims16