Repairable multi-chip package

Abstract

A repairable multi-chip package is provided. The repairable multi-chip package comprises a first chip, a second chip, a substrate, and a molding part formed by molding the first chip and the second chip with a molding resin. The substrate comprises a substrate body and wiring patterns, the substrate body has an upper surface on which the first chip and the second chip are mounted and a lower surface. The wiring patterns are formed on the upper surface of the substrate and are electrically interconnected to the first and second chips. The wiring pattern comprises ground patterns, power patterns, dual patterns, and most significant bit (MSB) patterns. By redistributing exposed parts of the power patterns, the dual patterns, and the MSB patterns, a multi-chip package that is determined to be a partially-failed package may be repaired making the device useable.

Dependencies are inferred from the claim text.