Silicon-based thin-film photoelectric device
AssigneeKaneka Corporation
InventorsYuko Tawada, Akihiko Nakajima, Masashi Yoshimi
Life of this patent
Estimating the term…
Abstract
A silicon-based thin film photoelectric conversion device includes a substrate 1, a back electrode 10 having a light reflecting metal film 102, at least one silicon-based photoelectric conversion unit 11 and a front transparent electrode 2, wherein at least one of the light reflecting metal film 102 and the front transparent electrode 2 has that surface thereof closer to the silicon-based photoelectric conversion unit provided with convexities and concavities having a level difference therebetween in a range of 0.01 to 2 μm and a pitch greater than the level difference and no more than 25 times the level difference.
Claims12
A silicon-based thin film photoelectric conversion device comprising a substrate, a back electrode having a light reflecting metal film, at least one silicon-based photoelectric conversion unit and a front transparent electrode, wherein at least one of said light reflecting metal film and said front transparent electrode has that surface thereof closer to said silicon-based photoelectric conversion unit provided with convexities and concavities having a level difference therebetween in a range of 0.01 to 2 μm and a pitch larger than said level difference and no more than 25 times said level difference, and the transparent electrode or back electrode, further from the substrate, has a smaller unevenness pitch as compared to the back electrode or transparent electrode, nearer to the substrate;
- and
- wherein at least one said photo electric conversion unit includes a first conductivity type layer, a crystalline silicon-based photoelectric conversion layer, and an opposite conductivity type layer;
- and
- wherein said crystalline silicon-based photoelectric conversion layer is formed, with a substrate temperature of no more than 400° C., and said crystalline silicon-based photoelectric conversion layer has a crystallized volume fraction of at least 80%, a hydrogen content in a range of 1 to 30 atomic %, a thickness in a range of 0.5 to 20 μm, a preferential crystal orientation plane of (110) parallel to a film surface thereof, and an x-ray diffraction intensity ratio of no more than 0.2 as a (111) diffraction peak to (220) diffraction peak ratio.
Dependencies are inferred from the claim text.