Optocoupler package being hermetically sealed
OwnerBenedict G Paceinventor
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Abstract
A compact, rugged, optocoupler which is a self-contained package. The optocoupler has a photon emitter mounted on the conductive pattern of a first, inorganic substrate, and a photon detector mounted on the conductive pattern of a second, inorganic, insulating substrate. The first and second substrates are bonded to an inorganic frame to form a cell containing a photon emitter opposite a photon detector. The first and second substrates and the frame also constitute the walls of the self-contained package. The optocoupler package may be manufactured with one or multiple cells in a package.
Claims44
An optocoupler package comprising first and second, inorganic, insulating substrates and an inorganic, ring frame joining the first and second substrates forming a cell;
- the first substrate being a ceramic circuit having a conductive pattern with at least one photon emitter mounted directly thereon;
- the second substrate being a ceramic circuit having a conductive pattern with at least one photon detector mounted in direct, over-under opposition to the photon emitter;
- the frame being bonded to the first and second substrates, and
- the cell being hermetically sealed, capable of containing an inert environment, and forming a completely self-contained, optocoupler package.
A package having a plurality of optocouplers, the package comprising first and second inorganic, insulating substrates and a common frame sealed to the first and second inorganic substrates forming a plurality of hermetically sealed cells;
- the first and second insulating substrates having a plurality of photon emitters and photon detectors mounted thereon so that each cell enclosing an optocoupler has at least one photon emitter opposing at least one photon detector;
- the package being hermetically sealed and capable of containing an inert atmosphere.
A method of manufacturing an optocoupler package comprising:
- providing first and second, inorganic insulating substrates;
- forming conductive patterns on the substrates;
- mounting at least one photon emitter on the conductive pattern of the first insulating substrate;
- mounting at least one photon detector on the conductive pattern of the second insulating substrate;
- providing an inorganic, ring frame capable of surrounding the photon emitter and photon detector, and
- bonding the frame to the first and second substrates, forming a hermetic seal, enclosing the photon emitter and photon detector spaced apart from and opposite each other, the first and second substrates and the frame forming the exterior surfaces of the package.
A method of manufacturing a hermetically sealed package containing a plurality of optocouplers comprising:
- printing a conductive pattern on a first, ceramic, insulating substrate;
- printing a conductive pattern on a second, ceramic, insulating substrate;
- mounting a plurality of photon emitters and photon detectors directly on the conductive patterns of the first and second substrates;
- bonding a ceramic frame between the first and second substrates forming a hermetic seal, the frame having a plurality of cells, each cell enclosing at least one photon emitter opposite at least one photon detector.
A method of manufacturing a hermetically sealed optocoupler package comprising:
- forming a conductive pattern on a first, planar, insulating, ceramic, substrate, the conductive pattern including conductors on the edge of the substrate;
- mounting at least one photon emitter directly on the conductive pattern of the first substrate;
- forming a conductive pattern on a second, planar, insulating, ceramic, substrate, the conductive pattern including conductors on the edge of the substrate;
- mounting at least one photon detector directly on the conductive pattern of the second substrate;
- providing a ceramic, ring frame having conductors on its outer edges;
- positioning the frame between the first and second substrates with the edge conductors of the frame, and first and second substrates aligned creating a cell containing a photon emitter opposite a photon detector;
- bonding the first and second substrates to the frame forming a hermetic seal, and
- electrically connecting the edge conductors of the package.
Dependencies are inferred from the claim text.