Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate

A method of molding a molding resin case on a switch substrate, comprising:

• manufacturing the switch substrate by forming preliminary patterns on a surface of a film-like substrate in advance, then providing openings by removing pattern-removal portions of the preliminary patterns to thereby form switch patterns with which a slider is to make sliding contact;
• preparing the switch substrate, a first mold and a second mold and clamping the switch-substrate between the first mold and the second mold in such a manner that a first side of the switch substrate is brought into contact with a surface of the first mold while, simultaneously, a cavity provided in the second mold is arranged to oppose a second side of the switch substrate;
• charging molten molding resin into the cavity provided in the second mold to thereby fill the cavity and the openings of the switch substrate with the molding resin;
• and
• extracting the switch substrate, which has the molding resin attached thereto, by separating the first mold and the second mold after the molding resin hardens to form the molding resin case.

A method of forming switch patterns, with which a slider is to make sliding contact, on a switch substrate, comprising:

• forming preliminary patterns on a surface of the substrate in advance;
• forming insulating patterns between portions of the preliminary patterns that are to become switch patterns;
• and
• forming the switch patterns by removing pattern-removal portions at boundaries between the portions of the preliminary patterns and the insulating patterns.