US 6,388,203 B1 · Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby

Abstract

A controlled-shaped solder reservoir provides additional solder to a bump in the flow step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and sized to provide predetermined amounts of solder to the solder bump. Thus, the height of the resulting solder bump can be predetermined. The solder reservoirs can be shaped to take a minimum amount of space, such as by at least partially wrapping around the solder bump. Consequently, the solder bumps may have increased height without adding to the space requirements of the solder bump, or without increasing the fabrication cost. In addition, due to the finite time required for solder flow, a means of sequencing events during soldering is provided.

Claims21

Dependent claims

A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder reservoir portion and a solder bump portion, wherein said solder reservoir portion is non-linear in shape, and wherein said solder reservoir portion at least partially wraps around said solder bump portion.

Dependencies are inferred from the claim text.

Facts

Application

09/122,285Filed 24 Jul 1998 · continuation in part

Priority

5 Apr 1995

Granted

14 May 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification22 codes

H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
C08F 8/44
Chemical modification by after-treatment: preparation of metal salts or ammonium salts
H05K 3/3436
Leadless components: having an array of bottom contacts, e.g. pad grid array or ball grid array components
H10W 72/012
Manufacture or treatment: of bump connectors, dummy bumps or thermal bumps

Family

Application08/416,419Parent of this continuation · filed 5 Apr 1995

Application60/053,761Us provisional application · filed 25 Jul 1997

Application08/977,258Parent of this continuation-in-part · filed 24 Nov 1997

US 5,892,179 AParent of this continuation-in-part

Application08/977,258Parent of this continuation

US 6,388,203 B1This patent

From the US filing history. Foreign family members aren’t listed.

Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby

Life of this patent

Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby

Life of this patent

Abstract

Claims21