Multi layer printed circuit board

A multi-layer printed circuit board, comprising:

• a central core substrate having first and second major opposing surfaces, one of the surfaces containing a first metallization pattern;
• a photoimaged dielectric layer deposited on the first surface, said photoimaged dielectric layer containing a second metallization pattern and photoimaged vias that electrically connect the second metallization pattern to the underlying first metallization pattern;
• a non-photoimageable dielectric layer deposited on the second surface and containing a third metallization pattern, and vias that electrically connect the third metallization pattern to the first metallization pattern.

A multi-layer printed circuit board comprising:

• a photoimaged dielectric layer on one side of a central core substrate and a non-photoimaged dielectric layer on an opposite side of the central core substrate, the photoimaged dielectric layer containing electrically conductive vias that are formed by a photolithographic process and the non-photoimaged dielectric layer containing electrically conductive vias that are formed by a laser.