Wired circuit board
AssigneeNitto Denko Corporation
InventorsTakeshi Yamato, Kenichiro Ito
Life of this patent
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Abstract
To provide a wired circuit board capable of surely preventing occurrence of a short circuit between a metal terminal layer and a metal supporting layer with a simple construction, to provide improvement in connection reliability and in voltage proof property, a wired circuit board comprises a base layer formed on a supporting board, a conductive layer formed on the base layer, a surface of the conductive layer being exposed by opening the supporting board and the base layer, and a metal plated layer formed on the conductive layer exposed in the openings of the supporting board and the base layer, wherein a specified space is defined between a periphery of the metal plated layer and a periphery of the opening of the supporting board.
Claims3
A wired circuit board comprising an insulating layer formed on a metal supporting layer, a conductive layer formed on the insulating layer, a surface of the conductive layer being exposed by opening the metal supporting layer and the insulating layer, and a metal terminal layer formed on the conductive layer exposed in the openings of the metal supporting layer and the insulating layer, wherein a specified space is defined between a periphery of the metal terminal layer and a periphery of the opening of the metal supporting layer.
Dependencies are inferred from the claim text.