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US 6,388,009 B1Granted
Carboxyl or anhydride-functional styrene/p-alkylstyrene copolymer, epoxy resin and curing agent
AssigneeIndustrial Technology Research Institute
InventorsWei-Han Liao, Hsien-Yin Tsai, In-Mau Chen
Life of this patent
Estimating the term…
Abstract
A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.
Claims15
A resin composition for electric circuit boards, comprising:
- (a) 20-99.9 parts by weight of a carboxyl or acid-anhydride functionalized syndiotactic styrene/para-alkylstyrene copolymer having microfoaming when being cured;
- (b) 0.01-80 parts by weight of a mixture of epoxy resins;
- and
- (c) a minimum amount effective to cure said composition to less than 50 parts by weight of a curing agent selected from the group consisting of an aromatic polyamine, a secondary amine, a tertiary amine, a polycarboxylic acid anhydride and dicyandiamide.
1 more element
A laminate for printed circuit board, comprising a sheet made from the resin composition as set forth in claim
- being laminated with a glass cloth.
Dependencies are inferred from the claim text.