Time-based semiconductor material attachment

A method for attaching semiconductor die during manufacture comprising:

• a) moving a placement tool carrying a semiconductor die to a first position over a second semiconductor material having an adhesive placed thereon;
• b) releasing the placement tool to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the placement tool to fall toward and into the adhesive sufficiently to leave a predefined bond line thickness for the adhesive between the semiconductor die and the second semiconductor material;
• and
• c) stopping the fall of the placement tool after the predefined period of time.

A system for controlling attachment of semiconductor materials during manufacture of a semiconductor comprising a control system with a placement tool adapted to pick up and move a first semiconductor material, said control system adapted to:

• a) move the placement tool carrying the first semiconductor material to a first position over a second semiconductor material having an adhesive placed thereon;
• b) release the placement tool to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the placement tool to fall toward and into the adhesive sufficiently to leave a defined thickness of the adhesive between the first and second semiconductor materials;
• and
• c) stop the fall of the placement tool after the predefined period of time.

A system for attaching semiconductor materials during manufacture comprising:

• a) means for placement of a first semiconductor material;
• b) means for moving the means for placement carrying the first semiconductor material to a first position over a second semiconductor material having an adhesive placed thereon;
• c) means for releasing the means for placement to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the means for placement to fall toward and into the adhesive sufficiently to leave a defined thickness of the adhesive between the first and second semiconductor materials;
• and
• d) means for stopping the fall of the means for placement after the predefined period of time.