Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned adhesive layer on a portion of the active surface. A leadframe having leads with inner lead ends and outer lead ends is provided. The inner lead ends of the leads are aligned proximate to the adhesive-free area and the leads are attached to the adhesive layer on the active surface of the semiconductor chip. The outer lead ends are oriented to form a footprint which is not substantially larger than the dimensions of the semiconductor chip.
Claims47
A method for packaging an integrated circuit including a semiconductor chip and a leadframe, the semiconductor chip having an active surface with lateral boundaries, and having bond pads on the active surface, the leadframe comprising leads having inner ends and outer ends, the method comprising:
- depositing an adhesive on the active surface of the semiconductor chip to define a patterned
- adhesive layer on a portion of the active surface and at least one adhesive-free area proximate the bond pads;
- aligning the inner ends of the leads proximate to the at least one adhesive-free area and adhering the leads to the adhesive layer;
- attaching bond wires between the bond pads and the inner ends of the leads;
- forming a cap having outer boundaries that are substantially coextensive with outer, lateral boundaries of the semiconductor chip;
- shaping portions of the outer ends of at least some of the leads to receive and hold the cap between the outer ends of the leads and over the active surface of the semiconductor chip;
- and
- orienting at least a portion of the outer ends of the leads in a direction substantially transverse to the active surface of the semiconductor chip.
A method for packaging an integrated circuit including a semiconductor chip and a leadframe, the semiconductor chip having a back surface, an active surface opposing the back surface, having lateral boundaries, and having bond pads on the active surface, the leadframe comprising leads having inner ends and outer ends, the method comprising:
- depositing an adhesive on surfaces of the leads;
- aligning the inner ends of the leads proximate to the bond pads and attaching the surfaces of the
- leads bearing the adhesive to the active surface of the semiconductor chip;
- attaching bond wires between the bond pads and the inner ends of the leads;
- forming a cap having outer boundaries that are coextensive with outer boundaries of the semiconductor chip;
- shaping portions of the outer ends of at least some of the leads to receive and hold the cap between the outer ends of the leads and over the active surface of the semiconductor chip;
- and orienting at least a portion of the outer ends of the leads in a direction transverse to the active surface of the semiconductor chip.
Dependencies are inferred from the claim text.