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US 6,387,731 B1Granted
Method and apparatus for reducing BGA warpage caused by encapsulation
AssigneeMicron Technology, Inc.
InventorsRichard Wensel, Scott Gooch
Life of this patent
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Abstract
The present invention provides a ball grid array (“BGA”) assembly and process of manufacturing for reducing warpage caused by the encapsulation of the associated semiconductor chip. The assembly and process includes coupling a substrate between a semiconductor chip and a BGA structure; attaching a stabilizing plate to the substrate adjacent the BGA structure; and encapsulating the semiconductor chip.
Claims23
A process of fabricating a semiconductor device assembly, comprising:
- providing a planar substrate including first and second surfaces;
- securing a semiconductor chip to the first surface of the substrate;
- coupling a BGA structure to the substrate on the second surface;
- attaching a stabilizing plate directly to the substrate on the second surface adjacent the BGA structure;
- and
- encapsulating the chip and a portion of the substrate adjacent the chip with an encapsulant
- wherein said stabilizing plate resists warpage of said substrate during said step of encapsulating.
4 more elements
A process of fabricating a semiconductor device assembly, comprising:
- providing a substantially planar substrate;
- attaching a ball grid array (“BGA”) structure to a first surface of the substrate;
- mounting a semiconductor chip to a second surface of the substrate;
- mounting a reinforcing element directly to the periphery of the first surface of the substrate;
- and
- applying a protective layer to and over the chip and a portion of the substrate adjacent the chip
- wherein said reinforcing element resists warpage of said substrate during said step of applying a protective layer to and over the chip.
4 more elements
Dependencies are inferred from the claim text.