Die-to-insert permanent connection and method of forming
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood
Life of this patent
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Abstract
The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-based bond pads on the die to form a permanent die-to-insert connection. The process for diffusing the gold bumps into the bond pads preferably occurs during a burn-in process wherein pressure and heat are applied to the die/substrate assembly without melting the gold bumps until a permanent die-to-insert substrate connection is properly made.
Claims16
A method of forming chip-to-substrate electrical interconnections, comprising:
- forming a plurality of conductive connection bumps on a surface of a substrate, each conductive connection bump formed of a diffusible material having a melting temperature;
- placing a plurality of semiconductor chips onto the substrate, each of the semiconductor chips having a plurality of bond pads thereon, with at least some of the plurality of bond pads of each semiconductor chip correspondingly in contact with at least some of the plurality of conductive connection bumps of the substrate;
- applying a force to bias the substrate and the plurality of semiconductor chips together;
- and
- heating the substrate and the plurality of semiconductor chips under the applied force to a temperature less than a lowest melting temperature of the diffusible material of the conductive connection bumps and sufficient to diffuse the diffusible material of the plurality of conductive connection bumps correspondingly in contact with the at least some of the plurality of bond pads to form metallurgical bonds therebetween.
A process for forming a permanent semiconductor die-to-substrate electrical interconnection during burn-in of semiconductor dies, comprising:
- inserting a substrate having a plurality of conductive connection bumps thereon into a die carrier, the plurality of conductive connection bumps having a melting temperature;
- placing a plurality of semiconductor dies onto the substrate, each having a plurality of bond pads thereon, with at least some of the plurality of bond pads in a superimposed relationship with at least some of the plurality of conductive connection bumps of the substrate;
- biasing the plurality of bond pads of the plurality of semiconductor dies toward the plurality of conductive connection bumps of the substrate;
- and
- heating and burning-in the plurality of semiconductor dies within a temperature range not less than the melting temperature of the plurality of conductive connection bumps for a sufficient time which results in a plurality of permanent bump-to-bond pad interconnections through diffusion of the at least some of the plurality of conductive connection bumps into the at least some of the plurality of bond pads.
Dependencies are inferred from the claim text.