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US 6,387,537 B1Granted
Epoxy resin composition and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorFumihiro Umika
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AssigneeSumitomo Bakelite Co., Ltd.
InventorFumihiro Umika
Estimating the term…
The object of the present invention is to provide an epoxy resin compositions for encapsulating of semiconductors containing no bromine compounds and no antimony oxide and excellent in flame retardancy, moisture resistance, moldability, curability and electric characteristics. This composition is an epoxy resin composition containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame retardant, wherein the improvement comprises the red phosphorus-based flame retardant (E) having a total content of phosphate ion and phosphite ion extracted from the retardant when subjected to extraction with water at 80° C. for 20 hours is not more than 2000 ppm, the amount of the red phosphorus in the red phosphorus-based retardant being 20-40% by weight and the red phosphorus-based retardant being contained in an amount of 0.5-5% by weight in the whole resin composition.
An epoxy resin composition for encapsulating of semiconductors which contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame retardant, wherein the improvement comprises the red phosphorus-based flame retardant (E) having a total content of phosphate ion and phosphite ion eluted from the retardant when subjected to an extraction with water at 80° C. for 20 hours is not more than 2000 ppm, the amount of the red phosphorus in the red phosphorus-based retardant being 20-40% by weight and the red phosphorus-based retardant being contained in an amount of 0.5-5% by weight in the whole resin composition.
Dependencies are inferred from the claim text.