High temperature co-fired ceramic and low temperature co-fired ceramic combination electronic package device and method
AssigneePolese Company, Inc.
InventorsKenneth L. Jones, II, Robert B. Kunesh
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Abstract
A microelectronic multilayer ceramic package combines a high temperature cofired ceramic (HTCC) module or carrier with a low temperature cofired ceramic (LTCC) module or carrier using a bonding interface layer of electrically nonconductive epoxy having electrically conductive regions for providing electrical interconnection between carriers. The bonding layer also has regions of thermally conductive material for interfacing heat sources on one carrier with heat dissipators on another carrier. The bonding layer also has apertures which allow prominent structures extending from one carrier to pass though and into a corresponding cavity in another carrier.
Claims6
A microelectronic ceramic package comprises:
- a first high temperature co-fired ceramic body;
- a second low temperature co-fired ceramic body;
- a bonding layer mating said first body to said second body;
- wherein said bonding layer comprises:
- an electrically non-conductive portion, and a plurality of electrically conductive portions.
Dependencies are inferred from the claim text.