Single-crystal silicon wafer
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsIzumi Fusegawa, Masakazu Sato
Life of this patent
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Abstract
The high quality silicon wafer of large diameter is invented by mainly paying attention to the particles ascribed to the crystal and the wafer is optimal for manufacturing ultra highly integrated devices. The silicon wafer is of diameter of 300 mm and larger sliced from a single-crystal silicon ingot pulled by CZ method, the surface is mirror-polished and cleaned with ammonia based cleaning solution, and the number of particles of 0.083 μm and larger in size detected on its main surface is 120 and smaller and/or particles of 0.090 μm and larger in size is smaller than 80.
Claims6
A single-crystal silicon wafer of diameter equal to or larger than 300 mm for a semiconductor device to be fabricated with design rules equal to or smaller than 0.18 μm, wherein, concerning particles detected on a flat mirror-surface, a number of the particles equal to or larger than 0.083 μm in size is equal to or smaller than 120, and a number of the particles equal to or larger than 0.09 μm in size is equal to or smaller than 80.
A single-crystal silicon wafer of diameter equal to or larger than 300 mm produced by CZ method for a semiconductor device to be fabricated with design rules equal to or smaller than 0.18 μm, wherein a mirror-surfaced single-crystal silicon wafer of diameter equal to or larger than 300 mm is obtained from a single-crystal silicon pulled up with crystal growth rate equal to or lower than 0.4 mm/min in a constant diameter part, and after cleaned with ammonia based rinse, the number of particles equal to or larger than 0.083 μm in size detected on a mirror-like flat surface is equal to or smaller than 120 and the number of particles equal to or larger than 0.09 μm is equal to or smaller than 80.
Dependencies are inferred from the claim text.