Coating device for coating solder resist on both sides of a printed circuit board

An application device (1) for applying at least a solder resist onto both surfaces (2, 3) of a printed circuit board (4) wherein the printed circuit board is provided with structurized printed conductors, the application device comprising at least two application bodies (5, 6) that can be assigned to the corresponding surface (2, 3) of the board and are rotatably supported, wherein the application bodies (5, 6) are two screen printing drums arranged on both sides of an essentially horizontal transport path (7) of the printed circuit board (4), wherein a transport means (9) comprises conveyor belts (10) along the transport path (7) for transporting the printed circuit board, and the transport means (9) further comprises pressing means (11) that can be pressed onto a surface (2) of the board for holding the printed circuit board on the conveyor belts (10), wherein each screen printing drum (5, 6) is rotatably supported in a holding device (21) which has adjustably supported thereon a dispenser and application means that can be assigned to an inner circumference (22) of the screen printing drum (5, 6).