Flattening polishing device and flattening polishing method
AssigneeSony Corporation
InventorsShuzo Sato, Takuo Ihira
Life of this patent
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Abstract
A flattening polishing device and method of the present invention is provided with a first polishing buff and a second polishing wheel disposed coaxially, a moving mechanism for moving the respective polishing buff and wheel relative to each other in an axial direction and a rotary drive for rotating the respective polishing buff and wheel around a shaft, thus enabling flattening and polishing with high accuracy and no defects.
Claims11
A flattening polishing device adapted to flatly polish a surface of an object to be polished, comprising:
- first polishing means and second polishing means both having polishing surfaces and being coaxially disposed around a shaft, said first polishing means being disposed at an end of said shaft via a flange incorporating a bearing;
- moving means for moving said first polishing means, together with said shaft, relative to each of the polishing surfaces of said respective polishing means in an axial direction;
- rotary means for rotating said respective polishing means around said shaft;
- and
- a rotary table for disposing and rotating an object to be polished by said first and second polishing means.
A flattening polishing device adapted to flatly polish a surface of an object to be polished, comprising:
- a fixed shaft formed in a shape of a hollow cylinder in order to supply a polishing solution through said hollow cylinder;
- first polishing means having a shape of a disk disposed at one end of said fixed shaft and rotatable around the shaft;
- second polishing means in a shape of an annulus ring engaged with said first polishing means, arranged on an outer periphery of said first polishing means and rotatable around the shaft;
- moving means disposed on the outer end of said fixed shaft, moving said first polishing means together with said fixed shaft relative to each of the polishing surfaces of said respective polishing means;
- rotary means for rotating said respective polishing means around the shaft;
- and
- a rotary table for disposing and rotating an object to be polished by said respective polishing means.
A flattening polishing method adapted to flatly polish a surface of an object to be polished, comprising the steps of:
- rotating two polishing means, disposed in shapes of concentric circles, around a coaxial shaft, said first polishing means being disposed at an end of said shaft via a flange incorporating a bearing;
- moving said shaft together with one of said polishing means so that a polishing surface of said one of said polishing means protrudes more than a polishing surface of the other of said polishing means;
- polishing a surface of said object to be polished by said one of said polishing means while rotating said object to be polished on a rotating table;
- protruding the polishing surface of the other polishing means more than the polishing surface of the one polishing means;
- and
- polishing a surface of said object to be polished by the other polishing means while rotating said object to be polished on a rotating table.
A flattening polishing method adapted to flatly polish a surface of an object to be polished, comprising the steps of:
- rotating two polishing means disposed in shapes of concentric circles around a fixed shaft, said first polishing means having a shape of a disk disposed at one end of said fixed shaft and rotatable around the shaft, and said second polishing means being in a shape of an annulus ring engaged with said first polishing means, arranged on an outer periphery of said first polishing means and rotatable around the shaft;
- and
- concurrently polishing the surface of said object to be polished by said respective polishing means while rotating said object to be polished on a rotating table.
Dependencies are inferred from the claim text.