Method and apparatus for detecting wafer slipouts
AssigneeApplied Materials, Inc.
InventorTimothy J. Donohue
Life of this patent
Estimating the term…
Abstract
A method and apparatus for detecting the disengagement of a workpiece from a polishing head is provided. In one embodiment, the apparatus generally includes a polishing head and a detector. The polishing head has a fixed portion and a first portion. The detector is adapted to provide a metric indicative of relative motion between the fixed portion and the first portion.
Claims27
Apparatus for detecting disengagement of a workpiece comprising:
- a polishing head having a first portion and a second portion;
- and
- a detector adapted to provide a metric indicative of relative motion between the first portion and the second portion.
Apparatus for detecting disengagement of a workpiece comprising:
- a polishing material;
- a polishing head for retain the workpiece against the polishing material during polishing;
- and
- a detector adapted to provide a metric indicative of relative motion between the polishing material and the polishing head.
Apparatus for detecting disengagement of a workpiece comprising:
- a polishing head having a first portion and a second portion;
- and
- a means for detecting relative motion between the first portion and the second portion.
Apparatus for detecting disengagement of a workpiece comprising:
- a platen;
- a polishing material disposed on the platen;
- a polishing head supported above the polishing material, the polishing head having a first portion and a second portion;
- and
- a detector adapted to provide a metric indicative of motion between the first portion and the second portion.
A method for detecting disengagement of a workpiece from a polishing head comprising:
- pressing the workpiece retained in the polishing head against a polishing material;
- providing relative motion between the workpiece and the polishing material;
- and
- detecting motion of the polishing head in a direction normal to the polishing material.
Dependencies are inferred from the claim text.