Method of forming a solder ball

A method of forming solder balls on a die wafer comprising:

• providing a die wafer having a plurality of contact locations, the die wafer having an integrated circuit therein in electrical communication with the contact locations;
• contacting each of said contact locations with a portion of molten solder that is contiguous with a source thereof;
• separating each portion of molten solder that adheres to each respective contact location from the molten solder of said source before each portion of molten solder solidifies;
• and
• forming a plurality of solid solder balls from the portions of molten solder, each said solid solder ball being isolated from contact except at the respective contact locations.

A method of forming a solder ball on a die wafer comprising:

• providing a die wafer having a contact location, the die wafer having an integrated circuit therein in electrical communication with the contact location;
• contacting the contact location with a portion of molten solder that is contiguous with a source thereof, wherein the portion of molten solder adheres to the contact location;
• moving the die wafer, thereby separating the portion of molten solder that adheres to the contact location from the molten solder of said source before the portion of molten solder solidifies;
• wherein:
• the portion of molten solder is isolated from physical contact with the molten solder of said source;
• and
• the portion of molten solder that adheres to the contact location of the die wafer has a shape, and said shape is determined by an external force acting on the portion of molten solder that adheres to the contact location of the die wafer;
• and
• forming a partially spherical solid solder ball from the portion of molten solder while said solder ball is isolated from contact except at the contact location.

A method of forming a solder ball on a die wafer comprising:

• providing a die wafer having a contact location;
• contacting the contact location with a molten solder from a source thereof;
• and
• separating a portion of molten solder that adheres to the contact location from the molten solder of said source, the portion of molten solder being isolated from contact with the molten solder of said source before the portion of molten solder solidifies, wherein the portion of molten solder that adheres to the contact location is subjected to gravitational force while positioned at the contact location.

A method of forming solder balls on a die wafer comprising:

• providing a die wafer having a plurality of contact locations, the die wafer having an integrated circuit therein in electrical communication with the contact locations;
• contacting each of the contact locations with a molten solder from a source thereof;
• separating a respective portion of molten solder that adheres to each respective contact location from the molten solder of said source before the molten solder of each respective portion solidifies, wherein the respective portions of molten solder that adhere to the respective contact locations are subjected to gravitational force while being positioned at the contact locations;
• and
• forming a plurality of solid solder balls from the respective portions of molten solder, each said solid solder ball being isolated from contact except at the respective contact locations.

A method of forming a solder ball on a die wafer comprising:

• providing a die wafer having a contact location, the die wafer having an integrated circuit therein in electrical communication with the contact location;
• contacting the contact location with a molten solder from a source thereof;
• separating a portion of molten solder that adheres to the contact location from the molten solder of said source before the portion of molten solder solidifies;
• wherein:
• the portion of molten solder is isolated from physical contact with the molten solder of said source;
• and
• the portion of molten solder that adheres to the contact location of the die wafer has a shape, and said shape is determined by gravitational force acting on the portion of molten solder that adheres to the contact location;
• and
• forming a partially spherical solid solder ball from the portion of molten solder while said solder ball is isolated from contact except at the contact location.