Method of attaching a first part to a mating part
AssigneeHewlett-Packard Company
InventorMarvin G. Wong
Life of this patent
Estimating the term…
Abstract
A method of attaching a first part to a mating part. The method comprises depositing a bondable film layer over a surface of a first part and a solderable pad on the surface. The method further comprises creating an opening in the film layer around the solderable pad to expose the solderable pad, positioning a mating part near the first part so that a solderable pad on the mating part is adjacent a solder ball on the first part, and bonding the film layer to the mating part.
Claims17
A method of attaching a first part to a mating part, the method comprising the steps of:
- providing a first part having a surface with a solderable pad thereon;
- depositing a bondable film layer over the surface of the first part and the solderable pad;
- creating an opening in the film layer around the solderable pad to expose the solderable pad;
- forming a solder ball on the solderable pad;
- providing a mating part having a solderable pad thereon;
- positioning the mating part near the first part so that the solderable pad on the mating part is adjacent the solder ball on the first part;
- heating the solder ball and solderable pads to melt the solder, whereby a solder joint is formed to metallically join the first and mating part;
- and
- bonding the film layer to the mating part.
A method of using a film layer on a microelectronic part as a stencil for measuring and containing solder paste from which solder balls are created, the method comprising the steps of:
- providing a microelectronic part having a solderable pad thereon;
- depositing a polymer layer on the microelectronic part;
- creating at least one opening in the polymer layer, the opening defining a cavity around the solderable pad, the cavity sized to receive an amount of solder paste that reflows to form a solder ball sized for attaching a mating part to the microelectronic part;
- and
- filling the cavity with a solder paste.
Dependencies are inferred from the claim text.