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US 6,386,432 B1Granted
Semiconductor die pickup method that prevents electrostatic discharge
AssigneeSamsung Electronics Co., Ltd.
InventorsHo Tae Jin, Hee Kook Choi
Life of this patent
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Abstract
An embodiment of the present invention provides a pickup tool in accordance with the present invention includes multiple contact parts, which contact a passivation layer of a semiconductor chip so that the contact parts are far from chip pads and fuses when holding the semiconductor chip. Furthermore, a die bonding apparatus has one or two pickup tools, an aligning stage, and a bond stage or a bond head.
Claims5
A method for picking up a semiconductor device having an exposed electrical structure, the method comprising:
- selecting a pickup tool having contact portions in a pattern that avoids the exposed electrical structure;
- moving the pickup tool into proximity with the semiconductor device;
- applying an attractive force that holds the semiconductor device in contract with the contact portions, wherein the pattern of the contact portions of the pickup tool causes the pick up tool to avoid contact with the exposed electrical structure.
Dependencies are inferred from the claim text.