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US 6,386,084 B1Granted
Method for cutting substrate
AssigneeCanon Kabushiki Kaisha
InventorNaoki Kato
Life of this patent
Estimating the term…
Abstract
A method for cutting a substrate by scribing a scribe line in the substrate, wherein a working condition of the scribe line is varied during the scribing of one line.
Claims2
A method for cutting a substrate by scribing a scribe line in the substrate, wherein, in scribing at least two crossing scribe lines in the substrate, with a scribing speed for the two scribe lines being different from each other, the scribing speed for a scribing line formed by a following scribing is smaller.
Dependencies are inferred from the claim text.