Scrubbing apparatus
AssigneeTokyo Electron Limited
InventorsNobuo Konishi, Kenji Sekiguchi, Keizo Hirose
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AssigneeTokyo Electron Limited
InventorsNobuo Konishi, Kenji Sekiguchi, Keizo Hirose
Estimating the term…
A scrubbing apparatus is provided which sufficiently cleans every site on the wafer by a cleaning accelerating action of ultrasonic waves, the scrubbing apparatus comprising a substrate support section for supporting a substrate horizontally and substantially in contact with a circumferential portion of the substrate while front side and back side surfaces of the substrate are substantially kept untouched in operation by the substrate, rotation drive means for driving the substrate support section to rotate in order to give a rotation force to the substrate, a brush for scrub-cleaning the substrate while contacting at least the front surface, a main nozzle provided with a first supply circuit for supplying a-cleaning liquid in at least a central region of the substrate, an auxiliary nozzle provided with a second supply circuit for supplying the cleaning liquid in at least a peripheral region of the substrate, and an ultrasonic oscillator for applying ultrasonic waves to the cleaning liquid supplied on the substrate from an auxiliary nozzle.
A scrubbing apparatus for cleaning a surface of a substrate or a surface of a film on a substrate, comprising:
A scrubbing apparatus for cleaning a surface of a substrate or a surface of a film on a substrate, comprising:
Dependencies are inferred from the claim text.