High density multiple digital signal connection interface with reduced cross talk

A digital communication method for reducing cross talk in a high speed, high density connection interface between a pair of digital signal processing units, comprising the steps of:

• controlling said signal processing units to transmit digital data signals to be carried on connection paths formed by wire pair sets that respectively communicate with header and receptacle portions of a multiple pin connector, each wire pair of said wire pair sets carrying a single data signal in a single direction from a driver end to a receiver end of one of said connection paths;
• impedance matching said digital signals to the wire pairs of said wire pair sets at said driver end and said receiver end of each connection path;
• and
• exchanging said digital signals between said wire pairs sets through the pins of said connector such that adjacent signal carrying pin pairs of said connector carry only signals travelling in the same direction, and such that connector pin pairs carrying digital signals travelling in opposite directions are not adjacent to each other.

A digital communication system, comprising:

• a first digital signal processing unit;
• a second digital signal processing unit;
• a multiple pin connector including disconnectable header and receptacle portions;
• a first set of signal-carrying wire pairs providing communication between said header and one of said signal processing units;
• a second set of signal-carrying wire pairs providing communication between said receptacle and the other of said signal processing units;
• said first and second wire pair sets carrying bi-directional digital signals between said signal processing units and being attached to said connector such that there are two groups of adjacent connector pin pairs carrying only signals travelling in the same direction, and such that said connector pin pair groups are separated from each other;
• a pair of impedance matching units each having impedance matching circuits for each of the wire pairs of a respective one of said wire pair sets, each impedance matching circuit having a first side connected to a respective one of said signal processing units and a second side connected to one of said wire pairs at an impedance that substantially matches the wire pair impedance;
• said digital communication system being adapted to carry digital signals at speeds of up to at least approximately 622 Mbits/second;
• and
• said connector being configured for connecting a digital circuit board to a backplane signal interconnector.