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US 6,382,030 B1Granted
Sensor and method of producing the same
AssigneeYamatake Corporation
InventorsTakashi Kihara, Yoshiyuki Ishikura, Takashi Masuda
Life of this patent
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Abstract
Pads 24 and 25 to be bonded to connection members are formed at positions where the pads face electrode extraction holes 4a to 4c. A bonding agent 12 low in wettability for the surfaces of electrodes 1 and 3 is used. The bonding agent 12 and high-wettability material form the surfaces of the pads 24 and 25. This can firmly bond the connection members to the electrodes 1 and 3, and can prevent the electrodes 1 and 3 from short-circuiting.
Claims11
A sensor comprising:
- a sensor main body in which a cavity which communicates with outside through at least one electrode extraction hole is formed;
- a first electrode arranged in the cavity to face a second electrode;
- at least one connection member inserted in the cavity through the electrode extraction hole;
- and
- at least one pad formed in the cavity and disposed between said connection member and one of said first and second electrodes, said connection member to electrically couple to said one of said first and second electrodes via said pad, said pad to face the electrode extraction hole, and bonded to said connection member, and made of a conductive material, wherein wettability of said connection member for a surface of said pad is higher than wettability of said connection member for a surface of each of said electrode.
2 more elements
Dependencies are inferred from the claim text.