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US 6,381,836 B1Granted
Clip and pin field for IC packaging
AssigneeIntel Corporation
InventorsJeff Lauruhn, Duncan MacGregor
Life of this patent
Estimating the term…
Abstract
An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which includes a pin field that contains a plurality of pins. The heat sink is coupled to the integrated circuit package by a clip that wraps around the sink and is attached to the spacer block.
Claims20
An electronic assembly, comprising:
- a socket including a pin socket;
- a spacer block including a latch, and a pin for insertion into said pin socket of said socket;
- a substrate mounted to said spacer block;
- an integrated circuit package mounted to said substrate;
- a heat sink adjacent to said integrated circuit package;
- a fan mounted on said heat sink;
- a clip that is wrapped around both said heat sink and said fan for attachment to said latch of said spacer block.
4 more elements
A method for assembling an electronic assembly, comprising:
- attaching a substrate to a spacer block which has a plurality of pins, said substrate supports an integrated circuit package;
- placing a heat sink onto said integrated circuit package;
- placing a fan onto said heat sink;
- wrapping a clip around said heat sink, said fan and said substrate;
- attaching said clip to said spacer block to secure said heat sink to said integrated circuit package;
- and,
- plugging said spacer block into a socket.
4 more elements
An electronic assembly comprising:
- a spacer block including a plurality of pins and a latch;
- a substrate placed on said spacer block;
- an integrated circuit package mounted to said substrate;
- a heat sink placed adjacent to said integrated circuit package;
- a fan placed adjacent to said heat sink;
- and
- a clip that wraps around said heat sink, said fan, and said substrate, said clip being attached to said spacer block.
4 more elements
A method comprising:
- providing a substrate including an integrated circuit package;
- attaching said substrate to a spacer block, said spacer block including a plurality of pins;
- placing a heat sink onto said integrated circuit package;
- placing a fan onto said heat sink;
- wrapping a clip around said fan and said heat sink;
- attaching said clip to said spacer block;
- and
- plugging said plurality of pins of the spacer block into a corresponding plurality of pin sockets of a socket.
5 more elements
An electronic assembly comprising:
- a socket;
- a spacer block including a latch;
- a substrate mounted to said spacer block;
- an integrated circuit package mounted to said substrate;
- a heat sink adjacent to said integrated circuit package;
- a fan mounted on said heat sink;
- and
- a clip that is wrapped around both said heat sink and said fan for attachment to said latch of said spacer block.
5 more elements
Dependencies are inferred from the claim text.