Microcircuit assembly having dual-path grounding and negative self-bias

A microcircuit assembly, comprising:

• an integrated circuit structure having a circuit ground, wherein the integrated circuit structure is operable to process signals having a frequency of no less than about 0.9 GHz;
• a grounded metallic carrier;
• a dielectric substrate having a top surface, a bottom surface contacting the carrier, and a capacitor via extending through the dielectric substrate;
• a metallization on the top surface of the substrate, the metallization including
• an input metallization trace to the integrated circuit structure,
• an output metallization trace from the integrated circuit structure, and
• a substrate ground plane upon which the integrated circuit structure is affixed;
• and
• a capacitor residing in the capacitor via and electrically connected between the substrate ground plane and the carrier.

A microcircuit assembly, comprising:

• a monolithic microwave integrated circuit structure having a circuit ground;
• a grounded metallic carrier;
• a dielectric substrate having a top surface, a bottom surface contacting the carrier, and a capacitor via extending through the dielectric substrate;
• a metallization on the top surface of the substrate, the metallization including
• an input metallization trace to the integrated circuit structure,
• an output metallization trace from the integrated circuit structure, and
• a substrate ground plane upon which the integrated circuit structure is affixed;
• a capacitor residing in the capacitor via and electrically connected between the substrate ground plane and the carrier;
• and
• an electrical resistor electrically connected between the circuit ground of the integrated circuit structure and the carrier.

A microcircuit assembly, comprising:

• an integrated circuit structure having a circuit ground;
• an electrical input to the integrated circuit structure;
• an electrical output from the integrated circuit structure;
• an electrically conductive carrier having a carrier ground thereto;
• a dielectric substrate having a top surface to which the integrated circuit structure is affixed and a bottom surface affixed to the carrier;
• a capacitor structure electrically connected between the circuit ground and the carrier ground through the carrier;
• and
• an electrical resistor electrically connected between the circuit ground of the integrated circuit structure and the carrier.