Compositions of interpolymers of α-olefin monomers with one or more vinyl or vinylidene aromatic monomers and/or one or more hindered aliphatic or cycloaliphatic vinyl or vinylidene monomers blended with a conductive additive

A conductive foam comprising a blend of polymeric materials comprising:

• (A) from about 10 to about 94 weight percent based on the combined weights of Components A, B, and C of at least one substantially random interpolymer;
• and wherein said interpolymer;
• (1) contains from about 0.5 to about 65 mole percent of polymer units derived from at least one vinyl or vinylidene aromatic monomer;
• (2) contains from about 35 to about 99.5 mole percent of polymer units derived from ethylene;
• (3) has a molecular weight (Mn) greater than about 1,000;
• (4) has a melt index (I2) of from about 0.01 to about 1,000;
• (5) has a molecular weight distribution (Mw/Mn) of from about 1.5 to about 20;
• and
• (6) has a distribution of said polymer units which can be described by the Bernoulli statistical model or by a first or second order Markovian statistical model;
• (B) from about 1 to about 25 weight percent (based on the combined weights of Components A, B, and C) of one or more conductive additives;
• and
• (C) from about 5 to about 89 weight percent (based on the combined weights of Components A, B, and C) of one or more polymers selected from the group consisting of:
• polypropylene, homopolymers of ethylene, and copolymers of ethylene and at least one other comonomer selected from the group consisting of:
• propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, and 1-octene;
• and wherein, for an injection or compression molded bar prepared from said blend and having a core, an upper and lower surface and a thickness of 3.175 mm, the conductivity at said upper or lower surface of said bar is greater than that at a surface of a bar also having a core, an upper and lower surface and a thickness of 3.175 mm but prepared only from a blend of Components B and C, and at the same concentration of Component B.