Redistributed bond pads in stacked integrated circuit die package
AssigneeRambus Inc.
InventorsBelgacem Haba, Donald V. Perino, Sayeh Khalili
Life of this patent
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Abstract
A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.
Claims17
A semiconductor module, comprising:
- a first integrated circuit die having a planar surface, said first integrated circuit die comprising:
- a first conductive pad disposed substantially on said planar surface and disposed substantially along a median line of said planar surface;
- a redistributed conductive pad electrically connected to said first conductive pad and disposed near a periphery of said planar surface;
- and
- a second integrated circuit die stacked adjacent to said planar surface and offset from said periphery, such that a second conductive pad on said second integrated circuit die can be electrically connected to said redistributed conductive pad.
A memory module, comprising:
- a first integrated circuit die having a planar surface, said first integrated circuit die comprising:
- a first conductive pad disposed substantially on said planar surface and disposed substantially along a median line of said planar surface;
- a redistributed conductive pad electrically connected to said first conductive pad and disposed near a periphery of said planar surface;
- a second integrated circuit die stacked adjacent to said planar surface and offset from said periphery, where said second integrated circuit die includes a second conductive pad;
- and
- a bus electrically connecting said redistributed conductive pad to said second conductive pad.
Dependencies are inferred from the claim text.