Wood fiberboard and manufacturing method therefor
AssigneeYamaha Corporation
InventorsRitsuo Iwata, Yoshihiro Hirano, Satoshi Suzuki, Katsunobu Fukuda, Hironori Watanabe
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Abstract
The wood fiberboard of the present invention comprises wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment bonded together by a binder resin, wherein the content of the wood fibers which have been subjected to an acetylation treatment is 35 to 90% by weight of the total amount of wood fibers which have been treated to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment.
Claims6
A wood fiberboard comprising wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment bonded together by a binder resin, wherein the amount of said wood fibers which have been subjected to an acetylation treatment is 35 to 90% by weight of the total amount of wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment.
A manufacturing method for wood fiberboard comprising heat and pressure forming a mixture comprising wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment and binder resin, wherein the amount of the wood fibers which have been subjected to an acetylation treatment is 35 to 90% by weight with respect to the total amount of wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been treated to an acetylation treatment.
Dependencies are inferred from the claim text.