Led component group with heat dissipating support
AssigneePatent-Treuhand-Gesellschaft fuer elektrische Gluehlampen mbH
InventorsAlois Biebl, Guenther Hirschmann
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Abstract
An optoelectronic component group has at least two LEDs (2) which are mounted on a support (3). The support is composed of a material having a thermal conductivity of better than 1.5 W/K×m, for example ceramic or composite material.
Claims18
An optoelectronic component group which is mounted on a support (3) and which comprises plural LEDs (2) at a prescribed distance (a) have a packing density of at least 4 LEDs per square centimeter, and associated connecting lines (4), wherein the support (3) has a thermal conductivity of at least 1.5 W/K×m.
An LED component group comprising:
- a support that has a thermal conductivity of at least 1.5 W/K×m and that has an exterior mounting surface;
- plural LEDs mounted directly on said exterior mounting surface, a distance between adjacent ones of said plural LEDs being no more than 5 mm, said plural LEDs having a packing density of at least 4 LEDs per square centimeter;
- and
- connections for said plural LEDs mounted directly on said exterior mounting surface.
An optoelectronic component group which is mounted on an exterior mounting surface of a support (3) and which comprises plural LEDs (2), which are spaced apart from one another and have a packing density of at least 4 LEDs per square centimeter, and associated connecting lines (4), wherein the support (3) dissipates heat well enough to realize a distance between adjacent LEDs of less than 2 mm, without limiting the specified forward current of the LEDs and without further aids.
Dependencies are inferred from the claim text.