Over-voltage protection for electronic circuits
AssigneeSurgX Corporation
InventorsGerald R. Behling, James B. Intrater
Life of this patent
Estimating the term…
Abstract
Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the electronic circuit. Microgaps between each contact portion and the corresponding ground bar are designed to provide an electrical conduit from the contact portion to the ground bar when normal operating voltages are exceeded, thereby channeling excess current harmlessly to ground. Under normal operating conditions, however, the microgaps act as electrical barriers, insulating the contact portions from ground. The microgaps may be filled with any combination of air, vacuum, or known variable voltage material.
Claims16
A packaging structure for protecting an electronic circuit from voltage transients, the electronic circuit being arranged in the packaging structure for connection to a secondary circuit, the packaging structure comprising:
- an insulating substrate;
- an array of electrically conductive contact portions disposed on the substrate, wherein the contact portions are electrically connected to the electronic circuit and are arranged to confront corresponding contact regions of the secondary circuit for direct connection therewith;
- at least one electrically conductive ground bar disposed on the substrate, the ground bar being adapted for electrical connection to ground;
- and
- an array of microgaps each associated with a corresponding contact portion of the array of contact portions and each being defined by said corresponding contact portion, a ground bar, and a separation distance between said corresponding contact portion and the ground bar, the microgaps each operating as an electrical connection between the corresponding contact portion and the ground bar at a voltage exceeding a predetermined threshold voltage and as an electrical barrier between the corresponding contact portion and the ground bar at a voltage below the predetermined threshold voltage.
A packaging structure for protecting an electronic circuit from voltage transients, the electronic circuit being arranged in the packaging structure for connection to a secondary circuit, the packaging structure comprising:
- an insulating substrate;
- an array of electrically conductive contact portions disposed on the substrate, wherein the contact portions are electrically connected to the electronic circuit and are arranged to confront corresponding contact regions of the secondary circuit for direct connection therewith, the array comprising a two-dimensional arrangement including at least three rows and three columns of contact portions;
- at least one electrically conductive ground bar disposed on the substrate, the ground bar being adapted for electrical connection to ground;
- and
- an array of microgaps each associated with a corresponding contact portion of the array of contact portions and each being defined by said corresponding contact portion, a ground bar, and a separation distance between said corresponding contact portion and the ground bar, the microgaps each operating as an electrical connection between the corresponding contact portion and the ground bar at a voltage exceeding a predetermined threshold voltage and as an electrical barrier between the corresponding contact portion and the ground bar at a voltage below the predetermined threshold voltage.
Dependencies are inferred from the claim text.