Method of component manufacture
AssigneeAmic AB
InventorsHans Göran Evald Martin, Per Ove Öhman
Life of this patent
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Abstract
The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3″) or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.
Claims31
A method of producing an electric, electronic, optical and/or mechanical component where a die or mould is used, where the substrate for said component is given a three-dimensional structure or shape, and where the substrate is adapted for further treatment or processing to build said component, characterised in that said substrate is formed by shaping said substrate against said die or mould, such as by moulding, pressing, extruding or embossing said substrate;
- that at least a part of said die or mould that corresponds to said component is produced by shaping against a model of said structure, e.g. by moulding or electroplating;
- that said model is produced by micromechanically working a material that has been suitably prepared to this end;
- and in that the three-dimensional structure or configuration of said model is chosen so as to correspond to desired component-associated surface parts, electric conductor paths, and/or further electric and/or electronic circuits;
- or that at least a part of said die or mould that corresponds to said component is produced by micromechanically working a material that is suitable for such working;
- and in that the three-dimensional structure or configuration of said die or mould is complementary in relation to desired component-associated surface parts, electric conductor paths and/or further electric and/or electronic circuits.
Dependencies are inferred from the claim text.