Thermally conductive grease composition and semiconductor device using the same
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTakayuki Takahashi, Kunihiro Yamada, Kenichi Isobe
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Abstract
A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 μm; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 μm and coarse metallic aluminum powder having an average particle size of 10 to 40 μm; and a semiconductor device utilizing the aforesaid grease composition.
Claims16
A thermally conductive grease composition comprising (A) 100 parts by weight of a base oil wherein said base oil is at least one oil of a liquid silicone, a liquid hydrocarbon or a fluorinated hydrocarbon oil wherein said fluorinated hydrocarbon oil is at least one oil selected from a polychlorotrifluoroethylene, a fluoroester or a polyperfluoroalkyl ether, (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 μm and (C) zinc oxide powder having an average particle size in the range of 0.2-5 μm or hexagonal boron nitride powder having an average particle size in the range of 1-5 μm, wherein said aluminum powder is a 9:1 to 1:9 by weight mixture of fine metallic aluminum powder having an average particle size of 0.5 to 5 μm and coarse metallic aluminum powder having an average particle size of 10 to 40 μm, and said Components (B) and (C) are contained in a total amount of 900-1416 parts by weight per 100 parts by weight of said base oil and in proportion satisfying a relation that the (C)/[(B)+(C)] ratio is not greater than 0.5 by weight.
A thermally conductive grease composition having a thermal conductivity of at least 3.8 W/mk comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having an average particle size in the range of 0.5-50 μm wherein said aluminum powder is a 9:1 to 1:9 by weight mixture of fine metallic aluminum powder having an average particle size of 10 to 40 μm;
- wherein said base oil is at least one oil of a liquid silicone, a liquid hydrocarbon or a fluorinated hydrocarbon oil wherein said fluorinated hydrocarbon oil is at least one oil selected from a polychlorotrifluoroethylene, a fluoroester or a polyperfluoroalkyl ether.
A semiconductor device holding a thermally conductive grease composition having a thermal conductivity of at least 3.8 W/mk between a semiconductor element and a dissipator to remove the heat the semiconductor element generates, wherein the thermally conductive grease composition comprises (A) 100 parts by weight of a base oil wherein said base oil is at least one oil of a liquid silicone, a liquid hydrocarbon or a fluorinated hydrocarbon oil wherein said fluorinated hydrocarbon oil is at least one oil selected from a polychlorotrifluoroethylene, a fluoroester or a polyperfluoroalkyl ether and (B) 500 to 1,200 parts by weight of metallic aluminum powder having an average particle size in the range of 0.5-50 μm and forms a layer having a thickness of 50 to 500 μm wherein said aluminum powder is a 9:1 to 1:9 by weight mixture of fine metallic aluminum powder having an average particle size of 0.5 to 5 μm and coarse metallic aluminum powder having an average particle size of 10 to 40 μm.
Dependencies are inferred from the claim text.