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US 6,371,200 B1Granted
Perforated heat sink
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorDeran S. Eaton
Life of this patent
Estimating the term…
Abstract
A compact perforated heat sink having high heat dissipation has a substrate with a multitude of holes and a thermal conductive pathway to conduct heat from a heat source to the substrate. The surface area of the holes is equal to or greater than the surface area of the substrate without the holes.
Claims15
A compact perforated heat sink having high heat dissipation consisting essentially of:
- at least one substrate forming a plurality of holes therein, wherein the surface area of the substrate with the holes is equal to or greater than the surface area of the substrate without the holes;
- means for thermal conductivity attached to the at least one substrate capable of conducting heat from a heat source to the at least one substrate;
- and,
- means to create unidirectional flow of air through the holes comprising a shape having an airfoil with top and bottom sides, both having surface areas, wherein the surface area of the top is greater than the surface area of the bottom.
1 more element
A method for dissipating heat from an electronic component, comprising the steps of:
- providing a compact perforated heat sink having high heat dissipation consisting essentially of at least one substrate forming a plurality of holes therein, wherein the surface area of the substrate with the holes is equal to or greater than the surface area of the substrate without the holes, means for thermal conductivity attached to the at least one substrate capable of conducting heat from a heat source to the at least one substrate, and, means to create unidirectional flow of air through the holes comprising a shape having an airfoil with top and bottom sides, both having surface areas, wherein the surface area of the top is greater than the surface area of the bottom;
- conducting air flow into the substrate through the means for thermal conductivity wherein the air flow contacts the top and bottom sides and the holes of the substrate.
A dissipated heat product formed by the process comprising the steps of:
- providing a compact perforated heat sink having high heat dissipation consisting essentially of at least one substrate forming a plurality of holes therein, wherein the surface area of the substrate with the holes is equal to or greater than the surface area of the substrate without the holes, means for thermal conductivity attached to the at least one substrate capable of conducting heat from a heat source to the at least one substrate, and, means to create unidirectional flow of air through the holes comprising a shape having an airfoil with top and bottom sides, both having surface areas, wherein the surface area of the top is greater than the surface area of the bottom;
- conducting air flow into the substrate through the means for thermal conductivity wherein the air flow contacts the top and bottom sides and the holes of the substrate.
Dependencies are inferred from the claim text.