Microphone assembly for hearing aid with JFET flip-chip buffer
AssigneesSarnoff Corporation, Tibbetts Industries, Inc.
InventorsPeter Madaffari, Walter P. Sjursen, Christopher Poux, Richard Moroney, Ponnusamy Palanisamy
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Abstract
A hearing aid microphone module housing all the electronic components needed for a functional hearing aid other than the battery and receiver is described which uses flip-chip technology to couple a JFET buffer to the components. The buffer is disposed on a PCB which defines a back volume of the housing.
Claims9
A hearing aid comprising an electret microphone formed of a metallic coated diaphragm laterally disposed at one end of a housing opposite a backplate and wherein said housing includes an inwardly extending sidewall and a front wall partly enclosing a back chamber which is acoustically sealed by a first PCB laterally extending across and contacting said sidewall at an open end of the housing, and wherein electronic components for the hearing aid are located on said first PCB and a first electrical connection is formed between said backplate and a gate terminal on a flip-chip semiconductor device on the first PCB and second and third electrical connections are made between said semiconductor device and an electrical component.
A hearing aid microphone assembly comprising an electret microphone formed of a metallic coated diaphragm laterally disposed at one end of a housing opposite a backplate and wherein said housing includes an inwardly extending sidewall and a front wall partly enclosing a back chamber which is acoustically sealed by a first PCB laterally extending across and contacting said sidewall at an open end of the housing, and wherein electronic components for the hearing aid are located on the first PCB and a first electrical connection is formed between said backplate and a gate terminal on a flip-chip device on the first PCB and second and third electrical connections are made between said device and an electrical component.
Dependencies are inferred from the claim text.