Flexible power assembly

A semiconductor device module comprising:

• a heatsink having a top surface and a bottom surface;
• a planar, thermally conductive substrate having a top surface and a bottom surface thermally connected to said top surface of said heatsink;
• at least one semiconductor device mounted on said top surface of said thermally conductive substrate;
• at least one circuit board, having a bottom surface and a top surface, arranged above and spaced from said top surface of said thermally conductive substrate;
• an enclosure means disposed between said top surface of said thermally conductive substrate and said bottom surface of said circuit board to define a space between said thermally conductive substrate and said bottom of said circuit board;
• at least one via for providing electrical communication from said semiconductor device to said top of said circuit board;
• at least one bonding wire electrically connecting said semiconductor device to said via;
• at least another device mounted on said top surface of said circuit board and electrically connected to said via.

An improved semiconductor device module of the type made from the combination of a support base having top and bottom surfaces and having an opening therein which extends from said top surface to said bottom surface, a length and a width of said support base defining a first area;

• a planar, thermally conductive substrate disposed in said opening in said support base such that a bottom surface of said substrate is disposed to contact an external heatsink located beneath said bottom surface of said support base, a length and a width of said planar, thermally conductive substrate defining a second area such that said first area is at least approximately six times larger than said second area;
• at least one semiconductor device mounted on a top surface of said thermally conductive substrate;
• at least one circuit board arranged above and spaced from said top surface of said base and having an opening therein that is situated above said thermally conductive substrate;
• at least another device mounted on a top surface of said circuit board;
• said top surface of said circuit board having at least one bonding pad area arranged at a periphery of said opening in said circuit board and being electrically connected to said another device;
• at least one bonding wire for connecting said one semiconductor device to said bonding pad;
• and a cover, having a planar top face, situated above said circuit board and said thermally conductive substrate wherein the improvement comprises:
• application of a conductive shielding material to said cover to reduce the allowance of radiated RFI noise from said at least one bonding wires.