Polyarylene compositions with enhanced modulus profiles
AssigneeThe Dow Chemical Company
InventorsJames P. Godschalx, Kenneth J. Bruza, Qing Shan J. Niu, Clark H. Cummins, Paul H. Townsend, III
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Abstract
This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.
Claims7
A composition comprising a partially polymerized reaction product of a reaction mixture comprising a compound having two or more cyclopentadienone functional groups and a compound having three or more acetylene functional groups, wherein the composition is further characterized by one or more of the following characteristics
- (a) the compound having three or more acetylene functional groups is selected from the group consisting of 4′,4′,4′-tris(phenylethynyl)-1,3,5-triphenylbenzene, and 3′,3′,3′-tris(phenylethynyl)-1,3,5-triphenylbenzene,
- (b) the reaction mixture further comprises a compound selected from the group consisting of bis-ortho-diacetylenes, mono-ortho-diacetylenes, bistriazenes, tetrazines, bisazides, and bissulfonylazides, or
- (c) the composition further comprises a reagent selected from the group consisting of bis-ortho-diacetylenes, mono-ortho-diacetylenes, bistriazenes, tetrazines, bisazides, and bissulfonylazides.
Dependencies are inferred from the claim text.