Detection of voids in semiconductor wafer processing
AssigneeJordan Valley Applied Radiation Ltd.
InventorsIsaac Mazor, Long Vu
Life of this patent
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Abstract
A method for testing the deposition and/or the removal of a material within a recess on the surface of a sample. An excitation beam is directed onto a region of the sample in a vicinity of the recess, and an intensity of X-ray fluorescence, emitted from the region in a spectral range in which the material is known to fluoresce, is measured. A quantity of the material that is deposited within the recess is determined responsive to the measured intensity.
Claims21
A method for testing the deposition of a material within a recess on the surface of a sample, comprising:
- directing an excitation beam onto a region of the sample in a vicinity of the recess;
- measuring an intensity of X-ray fluorescence emitted from the region in a spectral range in which the material is known to fluoresce;
- and
- determining a quantity of the material that is deposited within the recess responsive to the measured intensity.
Apparatus for testing the deposition of a material within a recess on the surface of a sample, comprising:
- an excitation source, configured to direct an excitation beam onto a region of the sample in a vicinity of the recess;
- one or more X-ray detectors, configured to receive X-ray fluorescence emitted from the region and to generate signals responsive to the received fluorescence;
- and
- a processor, coupled to receive the signals from the one or more detectors and to measure, responsive to the signals, an intensity of the fluorescence in a spectral range in which the material is known to fluoresce, so as to determine a quantity of the material that is deposited within the recess.
A semiconductor wafer, comprising a surface layer in which a test pattern is formed, the test pattern comprising:
- a test region, having a plurality of recesses formed in a surface layer thereof, in which recesses a material is deposited during production of semiconductor devices on the wafer;
- and
- a reference region, substantially without recesses.
Dependencies are inferred from the claim text.