Passively cooled solid-state laser

A passively cooled laser diode assembly comprising:

• at least one laser diode bar for receiving electrical energy and converting said electrical energy to optical energy and heat;
• a heat sinking structure in direct thermal conductive communication with said laser diode bar for receiving said heat, said heat sinking structure comprises a base plate with a plurality of surfaces extending from said base plate and forming interstices therebetween;
• and
• a phase change material in contact with said extending surfaces of said heat sinking structure and changing from a solid form to a liquid form in response to said heat being received in said heat sinking structure.

A passively cooled laser medium assembly comprising:

• a solid-state laser medium for receiving input energy and converting said input energy into output energy and heat;
• a heat sinking structure in direct thermal conductive communication with said solid-state laser medium for receiving said heat;
• and
• a phase change material in contact with said heat sinking structure changing from a solid form to a liquid form in response to said heat being received in said heat sinking structure, wherein said phase change material changes from said solid form to said liquid form between about −35° C. and 55° C.

A passively cooled laser diode assembly, comprising:

• at least one laser diode bar for receiving electrical energy and converting said electrical energy to optical energy and heat;
• a heat sinking structure in direct thermal conductive communication with said laser diode bar for receiving said heat;
• and
• a phase change material in contact with said heat sinking structure changing from a solid form to a liquid form in response to said heat being received in said heat sinking structure, wherein said phase change material changes from said solid form to said liquid form at a temperature above the maximum ambient temperature of said passively cooled laser diode assembly when not in operation.

A passively cooled laser diode assembly, comprising:

• at least one laser diode bar for receiving electrical energy and converting said electrical energy to optical energy and heat;
• a heat sinking structure in direct thermal conductive communication with said laser diode bar for receiving said heat;
• and
• a phase change material in contact with said heat sinking structure changing from a solid form to a liquid form in response to said heat being received in said heat sinking structure, wherein said phase change material changes from said solid form to said liquid form between about −35° C. and 55° C.