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US 6,351,384 B1Granted
Device and method for cooling multi-chip modules
AssigneeHitachi, Ltd.
InventorsTakahiro Daikoku, Junri Ichikawa, Atsuo Nishihara, Kenichi Kasai
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AssigneeHitachi, Ltd.
InventorsTakahiro Daikoku, Junri Ichikawa, Atsuo Nishihara, Kenichi Kasai
Estimating the term…
A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.
A device for cooling a multi-chip module including a circuit substrate, a plurality of semiconductor devices mounted on said circuit substrate, a frame fixed to said circuit substrate, wherein the cooling device further comprises:
A method for cooling a multi-chip module including a circuit substrate, a plurality of semiconductor devices mounted on said circuit substrate, a frame fixed to said circuit substrate, and a sealing top plate thermally joined to the semiconductor devices, the sealing top plate having a peripheral portion mounted on the frame, the cooling method including:
Dependencies are inferred from the claim text.