Heat conducting device for a circuit board
AssigneeRaytheon Company
InventorAlbert P. Payton
Life of this patent
Estimating the term…
Abstract
A heat conducting device for providing a thermal path between a circuit board and a missile airframe includes a thermal plane that is adapted to receive a circuit board and a collar that encompasses at least a portion of the thermal plane. The collar has a first position that disengages the heat conducting device from at least a portion of the airframe and a second position that engages the heat conducting device with at least a portion of the airframe to provide a thermal path between the circuit board and the airframe.
Claims17
A heat conducting device for providing an adjustable thermal path between a circuit board and an airframe, comprising:
- a thermal plane adapted to receive a circuit board;
- a collar encompassing at least a portion of the thermal plane, the collar adjustable between a first position disengaged from at least a portion of the airframe to provide a high impedance thermal path between the circuit board and the airframe, and a second position engaging at least a portion of the airframe to provide a thermal path between the circuit board and the airframe;
- and
- an actuation device engaging the thermal plane and the collar to adjust the collar between the first position and the second position.
A method for providing an adjustable thermal path between a circuit board and an airframe, comprising:
- mounting a circuit board on a thermal plane;
- positioning a collar around at least a portion of the thermal plane;
- adjusting the collar to a first position disengaged from at least a portion of the airframe to provide a high impedance thermal path between the circuit board and the airframe;
- and
- adjusting the collar to a second position engaging at least a portion of the airframe to provide a thermal path between the circuit board and the airframe.
An assembly for providing adjustable thermal paths between a plurality of circuit boards and an airframe, comprising:
- a plurality of heat conducting devices, each heat conducting device comprising:
- a thermal plane adapted to receive a circuit board;
- a collar encompassing at least a portion of the thermal plane, the collar adjustable between a first position disengaged from at least a portion of the airframe to provide a high impedance thermal path between the circuit board and the airframe, and a second position engaging at least a portion of the airframe to provide a thermal path between the circuit board and the airframe;
- an actuation device engaging the thermal plane and the collar to adjust the collar between the first position and the second position;
- and
- a fastener assembly to couple the heat conducting devices together.
Dependencies are inferred from the claim text.