Multiple die stack apparatus employing T-shaped interposer elements
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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Abstract
Multiple integrated circuit devices in a stacked configuration that uses a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof.
Claims82
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads disposed on an active surface thereof and a bottom surface, comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
An apparatus for interposing between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device;
- a third surface having a first length and a first width;
- and
- a fourth surface having a length and a width smaller than said first width of said third surface, said third surface providing an overhang portion of said apparatus for protection of said plurality of bond pads disposed on said second semiconductor device and said fourth surface being mountable to the active surface of said second semiconductor device.
An apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion that protects the at least one bond pad on an active surface of a first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
A multiple semiconductor device stack apparatus comprising:
- a substrate;
- a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate;
- a first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device;
- and
- a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
A thermally conductive apparatus interposed between a first semiconductor device and a second semiconductor device, said first semiconductor device and said second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface, said apparatus comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than said first width of said first surface, said first surface comprising an overhang portion of said apparatus that protects said plurality of bond pads disposed on said first semiconductor device and said second surface being mountable to the active surface of said first semiconductor device.
A thermally conductive apparatus for interposing between a plurality of semiconductor devices, each semiconductor device of said plurality of semiconductor devices having at least one bond pad on an active surface thereof and a bottom surface, comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than said first width of said first surface, said first surface providing a protective overhang portion over the at least one bond pad on an active surface of a first semiconductor device of said plurality of semiconductor devices and said second surface being mountable to the active surface of said first semiconductor device.
A multiple semiconductor device stack apparatus comprising:
- a substrate;
- a first semiconductor device having at least one bond pad on an active surface thereof, mounted to said substrate;
- a thermally conductive first interposer device mounted to said first semiconductor device, on a side opposite said substrate, said first interposer device having a first surface of a first area and a second surface of a second area less than said first area with a first pair of recesses formed on opposing edges of said first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, said second surface mounted to the active surface of the first semiconductor device;
- and
- a second semiconductor device, mounted to said first surface of said first interposer device, opposite said first semiconductor device.
Dependencies are inferred from the claim text.