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AssigneeAmeritherm, Inc.
InventorsWilliam J. Ryan, Manfred Luttinger, Bhima Vijayendran, Jonathan M. Gorbold, Lewis Hamilton, Steve Skewes, Gary C. Adishian, Daniel J. Lincoln, Robert Sengillo, Jr., John Cunliffe
Estimating the term…
A susceptor composition that can bond two or more layers or substrates to one another and that can be used to coat or cut a substrate. The susceptor composition is activated in the presence of radio frequency (RF) energy. In one embodiment, the susceptor composition of the present invention comprises a susceptor and a carrier. The carrier and susceptor are blended with one another and form a mixture, preferably a uniform mixture. The susceptor is present in an amount effective to allow the susceptor composition to be heated by RF energy. In a preferred embodiment, the susceptor also functions as an adhesive. The susceptor is an ionic or polar compound and acts as either a charge-carrying or an oscillating/vibrating component of the susceptor composition. The susceptor generates thermal energy in the presence of an RF electromagnetic or electrical field (hereafter RF field).
A method of bonding or adhering a first substrate to a second substrate, comprising interposing a composition between the first and second substrates, said composition comprising an ionomer and a polar carrier, wherein said carrier and said ionomer are blended substantially with one another and form a mixture, and wherein said ionomer and/or said carrier are present in amounts effective to allow said composition to be heated by RF energy;
A method of bonding or adhering a first substrate to a second substrate in less than about one second, comprising interposing a composition between the first and second substrates, said composition comprising an ionomer and a polar carrier, wherein said carrier and said ionomer are blended substantially with one another and form a mixture, and wherein said ionomer and/or said carrier are present in amounts effective to allow said composition to be heated by RF energy;
A method of bonding or adhering a first substrate to a second substrate, comprising:
A method of bonding or adhering a first substrate to a second substrate, comprising interposing a composition between the first and second substrates, said composition comprising an ionomeric adhesive and a polar carrier having a dielectric constant of about 13-63 (25° C.), wherein said carrier and said ionomeric adhesive are blended substantially with one another and form a mixture, and wherein said ionomeric adhesive and/or said carrier are present in amounts effective to allow said composition to be heated by RF energy;
A method of bonding or adhering a first substrate to a second substrate, comprising interposing a composition between the first and second substrates, said composition comprising an ionomeric adhesive and a polar carrier, wherein said carrier and said ionomeric adhesive are blended substantially with one another and form a mixture, and wherein said ionomeric adhesive and/or said carrier are present in amounts effective to allow said composition to be heated by RF energy;
A method of applying a composition on a substrate, comprising applying a composition comprising an ionomeric adhesive and a polar carrier on said substrate, wherein said carrier and said ionomeric adhesive are blended substantially with one another and form a mixture, and wherein said ionomeric adhesive and/or said carrier are present in amounts effective to allow said composition to be heated by RF energy;
Dependencies are inferred from the claim text.