Form-in-place gasket for electronic applications
Assignee3M Innovative Properties Company
InventorsMitchell Huang, William B. Stockton
Life of this patent
Estimating the term…
Abstract
A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of about 7% to about 20%, a level of outgassing components of about 10 μg/g to about 45 μg/g and a Shore A hardness from about 45 to about 65.
Claims18
A form-in-place gasket produced using automated placement followed by curing of a pattern of a thixotropic non-silicone composition comprising:
- a liquid polyolefin oligomer;
- a reactive diluent;
- a thixotropic filler;
- and
- a curative, said form-in-place gasket, after curing, having a compression set of about 7% to about 20%, a level of outgassing components of about 10 μg/g to about 45 μg/g and a Shore A hardness from about 45 to about 65.
A non-silicone composition for form-in-place gaskets comprising:
- a liquid polyolefin oligomer;
- a reactive diluent;
- a thixotropic filler;
- and
- a curative, said non-silicone composition, after curing, having a compression set of about 7% to about 20%, a level of outgassing components of about 10 μg/g to about 45 μg/g and a Shore A hardness from about 45 to about 65.
Dependencies are inferred from the claim text.