Assembly of carrier and superconductive film

Abstract

A flux-pinning system comprised of a high temperature superconductor film on a carrier wherein the film is provided with a multiplicity of holes of a radius of 50 to 2000 nm serves as the basis for an electronic component which can be utilized in high frequency and radial frequency circuits and in conjunction with SQUIDs. The holes can be arranged with variable density over the film or in the form of a uniform hexagonal or square grid and the high temperature superconductor is preferably a YBa2Cu3O7 composition. The film has a configuration of a high frequency component and may be strip shaped or loop shaped.

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