Noncontact communication semiconductor device

Abstract

A compact noncontact communication semiconductor device having a multidirectional or omnidirectional antenna and usable in a minuscule space to which the applications have conventionally been difficult is provided. The outer peripheral portion of a spherical IC 1 is covered with an insulating layer 4 having a thickness equal to or larger than the diameter of the IC 1, and antenna patterns 2 are formed on the surface of the insulating layer 4. The antenna patterns 2 can be configured either with a winding or by microprocessing using etching or laser beam, for example, for the conductive film formed on the surface of the insulating layer 4. The antenna patterns 2 and the circuit pattern formed on the surface of the IC 1 are interconnected via a through hole 5.

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