Method for micro-mechanical structures

Abstract

A method for fabricating MEMS wherein a structural member is released without using a sacrificial layer. In one embodiment, the method comprises forming a buried hydrogen-rich layer in a semiconductor substrate, defining a release structure in the semiconductor substrate above the buried hydrogen-rich layer, and separating at least a portion of the release structure from the semiconductor substrate by cleaving the semiconductor substrate at the buried hydrogen-rich layer. The method can be used to fabricate hybrid devices wherein a MEMS device and a semiconductor device are formed on the same chip.

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